| Process Step | Items | Capability |
| Material | PI + Ra / ED Copper | OK |
| Theral conductive sheet + RA/ED 銅 | ||
| Board Dimension | Working Panel Size | 10" × 15.8"(250 mm × 400 mm) |
| 20" × 31.6"(500mm × 600mm) | ||
| Per Request | ||
| Finished Board Thickness | Flex：0.1~0.4 mm | |
| Rigid-Flex：0.6~2.4 mm | ||
| Inner Layer | Trace / Spacing | Min. 4 / 4 mil |
| Copper Weight | Max. 2 OZ (After Plated) | |
| Min. 1/3 OZ | ||
| FCCL Core Thickness | Max. 2mil | |
| Min. 0.5mil | ||
| Lamination | Layer Count | Flex：1L~4L |
| Rigid-Flex：Max. 6L | ||
| Drilling | Hole Size | Min. 8mil (0.2mm) |
| Plating | Aspect Ratio | 1：6 |
| Solder Resit | coverlayer | White / yellow |
| Photo Liguid | White / green / yellow / black | |
| Available Surface Finished | Immersion Gold(ENIG) | OK |
| Immersion Tin | OK | |
| Immersion Silver | OK | |
| OSP | OK | |
| Routing | Punch | Tolerance ± 0.1 mm |
| Routing | Tolerance ± 0.2 mm | |
| Others | Cloverlayer Paste | Tolerance ± 8 mil (0.2mm) |
| Adhesive Paste | Tolerance ± 12 mil (0.3mm) | |
| Resinforce Paste | Tolerance ± 12 mil (0.3mm) | |
| Semi-flex | OK | |
