| 工廠面積Company Plant Area: |
| 800米平方/m2 |
| 主要產品Product Portfolio: |
| Rigid Multi – Layer board and Rigid – Flex Multi – Layer with, 16 layers |
| Ultra thin FR4 and thermal conductive Substrate. |
| HDI technology (Type I and Type 2) |
| Flex up to 4-L |
| Rigid – Flex up to 8-L |
| Controlled impedance. |
| Mixed materials(i.e. Hybrid Construction for HF,HS and Thermal management.) |
| Metal core PCB (i.e. copper core and aluminium base.) |
| Ceramic substrate (i.e. Al2O3 Aln) |
| 特殊類型Special Types: |
| Double Layers Metal Core PCB |
| Double Sided Metal Core PCB |
| Load Board up to 800 mm * 500mm |
| Cavity Board |
