| Process Step | Items | Capability |
| Material | Request Material Tg | FR-402 (Tg 135℃) |
| FR-405 (Tg 150℃) | ||
| FR-406 (Tg 170℃) High Tg Material | ||
| FR-408 (Tg 180℃) High Tg Material | ||
| Copper foil (Inner / Outer) | Max. 5 OZ | |
| Min. 1/3 OZ | ||
| Special Material | GETEK | RG200D |
| ML200D | ||
| ROGERS | RO4003C | |
| RO4350 | ||
| ALUMINIUM | 5052-H32 | |
| Teflon | OK | |
| Board Dimension | Working Panel size | Max. 21" × 24" ( 530 mm × 610 mm ) |
| Finished Thickness | Max. 200mil (5.0mm) | |
| Min. 16mil (0.4mm) Mutil-layer | ||
| Inner layer | Trace / Spacing | Min. 3 / 3 mil |
| Copper Weight | Min. 1/3 OZ | |
| Max. 5 OZ | ||
| Core Thickness | Max. 80mil (2.0mm) | |
| Min. 2mil (0.05mm) | ||
| Lamination | Layer Count | Max. 16L |
| Min. 2L | ||
| Layer to Layer Registration | ± 5mil | |
| Drilling | Vias | Blind Vias |
| Buried Vias | ||
| Drill True Position | Tolerance ± 3 mil | |
| Drilling hole size | Min. 8mil (0.20mm) | |
| Plating | Aspect Ratio | 1：8 |
| Copper Wall Thickness | ≧0.8mil | |
| Outer Layer | Trace / Spacing | Min. 3 / 3 mil |
| Finished Trace Copper Thickness | Max. 5 OZ | |
| Min. 11mil | ||
| Surface Finished | HASL(Lead Free) | Max. 800μ" |
| Min. 50μ" | ||
| Immersion Gold(ENIG) | Max. 12 μ" | |
| Electrolytic Gold | Max. 50μ" | |
| Immersion Tin | Max. 40μ" | |
| Immersion Silver | Max. 25μ" | |
| OSP | OK | |
| Solder Mask | Solder Mask Thickness | Min. 0.4 mil |
| Solder Mask Dam Width | Min. 3mil | |
| Solder Mask egistration | ± 2mil | |
| Routing | Routing Width | Min. 30 mil |
| V-cut Angle | Min. 30° | |
| V-cut Residual | Min. 8mil (0.20mm) | |
| Bevelling Gradient | Min. 25° | |
| Test | SMT Pitch | Min. 10mil |
| BGA Pitch | Min. 32mil | |
| Impedance Control | Tolerance ± 10% | |
| Differential Impedance Control | Tolerance ± 10% |
